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Date: | Thu, 24 Aug 95 08:13:59 BST |
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Does anyone have any experiences or commemts on converting DIL components to a surface mounting which they can share with me? Our current in house workmanship standards donot allow butt joint solder joints. I have noted that in IPC SM 780 it talks about forming these parts to a SOIC leadform shape. I would appreciate any information on footprint/ landpad design, leadform profiles and solder joint reliability that anybody can send to me.
Regards
Neil Sellars
Principal Engineer
Radstone Technology PLC
UK
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