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Subject:
BGA Test Manf. Samples
From:
"Thorson, Kevin J @EAG" <[log in to unmask]>
Date:
Mon, 14 Aug 95 16:38:00 CST
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I am looking for off-the-shelf printed wiring boards and ball grid array 
package samples (preferably ceramic) for the profiling of assembly process 
parameters.

Also, are there any experienced assemblers willing to attach two 1mm pitch 
ceramic BGA's on two assemblies.

Please contact:
Kevin Thorson
(612) 456-2639

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