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| Date: | Wed, 9 Aug 1995 14:18:35 DST |
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On Wed, 09 Aug 95 13:54:14 EDT [log in to unmask] wrote:
> From: [log in to unmask]> Date: Wed, 09 Aug 95 13:54:14 EDT
> Subject: OSP (entek) and Press Fit Connectors
> To: [log in to unmask]
>
> From: Kelly Kovalovsky, Raw Card Quality Engineering
> Phone:704-595-7336 Tie Line:795-7336 FAX Ext. 4727
> Subject: OSP (entek) and Press Fit Connectors
> We have a card assembly that we currently build as a hot air solder
> level raw board. We would like to change the solderable surface to
> entek to solve some processability concerns. Our customer expressed a
> concern with the press fit connectors we use and entek compatability.
>
> When we asked AMP whether they have performed any testing or
> qualification of this type of connector with an entek board, they
> stated that they had not.
>
> I would like to receive some input on:
>
> 1) what our concerns should be with regard to entek and press fit
> connectors
>
> 2) suggestions on testing that can be done to alleviate the concerns
>
> 3) any existing reports, articles or field data on press fit
> connectors and raw board finishes
>
> IBM Microelectronics Division
> 6800 IBM Drive MG12/251
> Charlotte, NC 28262-8563
>
We are currently using a Kester OSP coating that is similar to the Entek
106.Our application is not the same as yours however we had concerns re-
garding long term instument reliability.Of particular interest was ground-
ing and signal alteration effects during environmental exposure.
Part of our test program was to run Mixed Flowing Gas (MFG)testing.This has
the ability to simulate X number of years of field exposure to a given
number of hours of chamber time.This testing was run in conjunction with
IBM Endicott Technology Assurance Div.
Gas types,concentrations and exposue times can be used to simulate various
life spans and environments.
BTW,our test results showed no diference between HAL and OSP for our
application.
Regards
Michael Barmuta
Staff Eng.
FLUKE.Corp.
206 356 6076
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