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Date: | Wed, 09 Aug 95 13:37:54 |
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On 9 August 1995, Kelly Kovalovsky wrote:
>> From: Kelly Kovalovsky, Raw Card Quality Engineering
>> Phone:704-595-7336 Tie Line:795-7336 FAX Ext. 4727
>> Subject: OSP (entek) and Press Fit Connectors
>> We have a card assembly that we currently build as a hot air solder
>> level raw board. We would like to change the solderable surface to
>> entek to solve some processability concerns. Our customer expressed a
>> concern with the press fit connectors we use and entek compatability.
>> When we asked AMP whether they have performed any testing or
>> qualification of this type of connector with an entek board, they
>> stated that they had not.
>> I would like to receive some input on:
>> 1) what our concerns should be with regard to entek and press fit
connectors
The first thing that I would be concerned with, is the degraded coating
that will result from the board assembly process...this will happen to
some degree no matter if you're using Cu-56 or Cu-106, the coating will
be degraded. That happen's from heat when the board goes through reflow
(if there's surface mount involved) or thru wave soldering. There also
was a post a while back from someone that was experiencing problems with
degrading the coating from the acid contained in the liquid latex masking
he was using as well...so now there's the problem of bare copper being
exposed.
>> 2) suggestions on testing that can be done to alleviate the concerns
I would think that some accelerated aging in a environmental chamber with
a detailed analysis afterwards, could probably tell you all you need to
know....
>> 3) any existing reports, articles or field data on press fit
>> connectors and raw board finishes
None that I've heard of, if AMP hasn't done any, I wouldn't know who
would have...although you might check with BURNDY, they make press-fits
too and may have done something....
>> IBM Microelectronics Division
>> 6800 IBM Drive MG12/251
>> Charlotte, NC 28262-8563
Kelly,
I'd like to ask a few dumb questions if I could...I was wondering why
you're thinking of going to ENTEK?
*Lead reduction?
*Fine pitch process problems?
*Hole diameter variances on press-fit locations from HASL?
Thanks and good luck!!!
////
| @@ / Steve Gregory
C ) Process Training Engineer
////
\_o Pragmatech Incorporated
| @@ / 101 Nicholson Lane
C ) San Jose, California 95134
\_o ////
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| @@ / Phone:(408) 943-1151
C ) Fax:(408)943-1461
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