From: Kelly Kovalovsky, Raw Card Quality Engineering                           
Phone:704-595-7336 Tie Line:795-7336 FAX Ext. 4727                             
Subject: OSP (entek) and Press Fit Connectors                                  
We have a card assembly that we currently build as a hot air solder            
level raw board. We would like to change the solderable surface to             
entek to solve some processability concerns. Our customer expressed a          
concern with the press fit connectors we use and entek compatability.          
                                                                               
When we asked AMP whether they have performed any testing or                   
qualification of this type of connector with an entek board, they              
stated that they had not.                                                      
                                                                               
I would like to receive some input on:                                         
                                                                               
1) what our concerns should be with regard to entek and press fit              
connectors                                                                     
                                                                               
2) suggestions on testing that can be done to alleviate the concerns           
                                                                               
3) any existing reports, articles or field data on press fit                   
connectors and raw board finishes                                              
                                                                               
IBM Microelectronics Division                                                  
6800 IBM Drive MG12/251                                                        
Charlotte, NC  28262-8563