Richard,
The accepted method for solderability aging is to use steam aging at
approximately 93 degrees C. I know that the solderability steam aging task
group of the IPC has been investigating this issue and has released several
reports that should interest you. These reports are IPC-TR-465-1 - Round Robin
Test on Steam Ager Temperature Control Stability and IPC-TR-465-2 - The Effect
of Steam Aging Time and Temperature on Solderability Test Results. If you have
further interest I suggest that you contact the Chairman of the Steam Aging Task
Group.
Tom Carroll
Hughes Aircraft Co.
(310) 334-4757
_______________________________________________________________________________
Subject: Accelerated aging of solder
From: [log in to unmask] at CCGATE
Date: 7/25/95 4:12 PM
Hello,
I would like to do some accelerated aging tests for solderability
of eutectic solder. The solder is over nickel over copper on board
material (FR-4). Does any one know any respectable tests in the
literature that claim to approximate 6 months and 1 year of solder
aging. If such a claim is not explicitly stated how are the results of
such tests viewed. Does the I.P.C. recommend a particular test. How
about the military? I have a programmable temperature and humidity
chamber at my disposal , but would like information on all tests.
Thanks
Rich
------------------------------------------------------------------
Richard Olsen Telephone (602)-268-3461
Continental Circuits Corp. Fax (602)-268-0208
3502 East Roeser Road Pager (602)-310-6245
Phoenix Arizona Internet [log in to unmask]
85040-2905
USA I make circuit boards,what do you do?
------------------------------------------------------------------
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