Hello,
     
        I would like to do some accelerated aging tests for solderability 
     of eutectic solder. The solder is  over nickel over copper on board 
     material (FR-4). Does any one know any respectable tests in the 
     literature that claim to approximate 6 months and 1 year of solder 
     aging. If such a claim is not explicitly stated how are the results of 
     such tests viewed. Does the I.P.C. recommend a particular test. How 
     about the military? I have a programmable temperature and humidity 
     chamber at my disposal , but would like information on all tests.
     
        Thanks
        Rich
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     Richard Olsen                Telephone (602)-268-3461
     Continental Circuits Corp.   Fax       (602)-268-0208
     3502 East Roeser Road        Pager     (602)-310-6245
     Phoenix Arizona              Internet  [log in to unmask]
     85040-2905
     USA                    I make circuit boards,what do you do?
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