TECHNET Archives

1995

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Alan Cable <[log in to unmask]>
Date:
Thu, 22 Jun 95 11:41:00 PDT
Content-Type:
text/plain
Parts/Attachments:
text/plain (37 lines)

 ESI Laser Systems Division has been a world leader in laser trimming and 
semiconductor memory repair for many years.  An exciting new product family 
for drilling micro-vias in printed circuit boards has generated so much 
interest that we are seeking additional engineers to support this area.


COMPANY:       Electro Scientific Industries
               13900 NW Science Park Drive
               Portland, OR  97229-5497
               (503) 641-4141

POSITION:      Applications Engineer II (2 POSITIONS)
               Job #   95065

RECRUITER:          Nancy Ikeda


DESCRIPTION:  Duties include: laminate via drilling process development, 
system demos, training and installation, and customer sample processing. 
 Operate all aspects of systems, diagnose problems and perform maintenance 
and alignment activities.  Train customers on use of system and 
customizing.   Support engineering product development.  Support sales and 
marketing with demonstrations, presentations, trade shows, etc.

QUALIFICATIONS REQUIRED:  BS Engineering Degree.  Experience in process 
development and customer training/installation.  Customer experience in the 
PCB fabrication, materials, or capital equipment industry.  Ability to work 
independently.  30-50% travel, unlimited passport, and occasional swing 
shift work.

PREFERRED QUALIFICATIONS:    Related MSc dgree.  Strengths in laser, optics, 
software, CAD/CAM and/or language skills desired.  Electronics/electrical 
technician skills.



ATOM RSS1 RSS2