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Tue, 12 Sep 95 12:30:01 -0400 |
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| From: |
"Jim Marsico" <"marsico%Organization=Industrial & Mfg'g Engineering%Telephone=516-595-5879"@a1.allin1.ALLIN1.umc> |
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ALL-IN-1 IOS Server for VMS V3.0 PBL123A (US) ENGLISH 21-MAR-1992 |
| From [log in to unmask] Sat Apr 27 14: |
46:16 1996 |
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Could anyone explain in layman's terms the C4 (controlled collapse chip
connection) method of die attachment? I'm trying to get a better
understanding of the process, alloy, etc. Also, when is this method
preferred over wire bonding?
Thanks in advance,
Jim Marsico
AIL Systems, Inc.
Deer Park, NY
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