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Date: | Fri, 12 May 95 10:25:04 CST |
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Does anyone know of good references for determining the maximum
current carrying capacity of traces of different trace widths and
copper weights. I've seen the tables in IPC-D-275, but am looking for
more extensive information. I'm also interested in knowing if there
are empirical equations describing max current.
Additionally I need to know the same information for vias. For a
given hole size and minimum plating thickness what is the maximum
current carrying capacity of a via. Is this affected by the use of
thermals on power and ground layers. Is this affected by whether the
via is bare copper, HASL coated, or solder filled?
I'd appreciate any inputs?
Thanks,
Thad McMillan
Dell Computer
[log in to unmask]
Ph # 512-728-5240
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