I am interested in possible solutions to thermal dissipation (heat sinking) 
for SMd devices. I understand some of the negative results of using ground 
planes as heat sinks ie warpage and poor solder adhesion. I would like to 
get a better feel for other options in heat sinking a SMD 3018 device in a 
single/double layer high density encapsulated environment. Cost/size 
requirements are a factor due to the nature of the electronic components 
manufacturing market. Vias next to the lands are our current solution. Any 
others? Your thoughts would be appreciated.           Regards, Ed Current
Edward K. Current
CAD Supervisor
Engineering Services
Power Convertibles Corp.
Ph#(520)628-8292ext.167
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