PCB Designers,
I'm looking for general information about
'Chip Scale Packaging'. What types of components and
their associated land patterns are available? Are any
of you using this type of technology, and if so what types
of concerns do you have in the manufacturing process?
What type of challenges in the layout of the circuit, and
any other general infromation?
Thanks
David Kennedy
(516) 563-2400 ext 4856