Subject: | |
From: | |
Date: | Tue, 12 Dec 1995 22:37:21 -0600 (CST) |
Content-Type: | TEXT/PLAIN |
Parts/Attachments: |
|
|
Pat
I have saved 27 email messages on osp's from the last year of TechNet
transactions. These range from cost issues to PTFE processing. I can
forward them if you are interested and have not seen them in the past.
Regards
Dave
***************************************************
David W. Bergman, Technical Director
IPC
2215 Sanders Road
Northbrook, IL 60062-6135
708-509-9700 x340 Phone
708-509-9798 Fax
email [log in to unmask]
***************************************************
On Tue, 12 Dec 1995 [log in to unmask] wrote:
> I would greatly appreciate any input regarding changing from
> HASL to OSP. We assemble heavy copper boards and are
> experiencing difficulties as we move to 0805 chip packages. We
> are comtemplating changing to OSP to alleviate some of the
> pain. I would appreciate any info regarding process changes we
> may have to make (pad design, pre-heat, flux application
> method, etc). A typical application is 4 layer board with 2
> oz. internals and 2 oz. externals plated to 3 oz. Three
> thermal cycles (top side reflow, bottom side epoxy cure, and
> wave solder). SOIC and SOT-23 on top, 0805 on bottom, plus
> through hole components. No-clean paste and wave solder flux,
> wave flux applied by foaming on most machines but spray fluxer
> also available. Assemblies have high thermal mass (large
> magnetics and heatsinks). Thanks for your help.
>
> Pat Bailey
> Zytec Corporation
> phone 507 637-2966 x355
> fax 507 644-3720
> e-mail [log in to unmask]
>
>
|
|
|