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| From: | [log in to unmask][log in to unmask] Jun 95 13:22:01 EDT606_- ---------- Forwarded Message ---------- From: Robert Willis, 100537,2615 TO: IPC, InterNet: [log in to unmask]DATE: 20/05/95 15:48 RE: Copy of: Solder Resist Cure Test Does any one know a test for measuring the degree of cure for solder resists that works and provides a useful measurement. I do not have any method apart form the IPC, BS or IEC methods which are not very good as most people in the circuit industry know. I am trying to use DSC at the pressent with limited luck. Bob Willis VP SMART Group Tel: 44 1245 351502 Fax: 44 1245 [log in to unmask] |
| Date: | Wed, 22 Nov 1995 10:42:01 -0500 |
| Content-Type: | text/plain |
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Problem with 6010 et al is not hydroscopic natiure of material, but actual
physial wicking of liquid into the product which is highly loaded with high
Er ceramics. Sometimes sufficient hot water rinsing will be enough to get
rid of the residue, but you'll have to experiment with times, temperatures,
etc.
Suggest trying a product such as Arlon's AR-1000 which has a protective
barrier to keep process liquids in place.
Arlon is in Delaware at 1-800-635-9333. Ask for Mark (there are two Marks
the one you want is in tech service).
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