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Date: | Wed, 15 Nov 95 18:30:00 PST |
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Hi,
Is there anyone can answer my question ?
What's the optimal baking condition for ML board before IR reflow ?
Before you answering, I should let you know what are the boards as below;
1.Some vacuum-package of ML boards had been destroyed,
before the boards baking.
2. The shipping date of some boards are more than 7 monthes ago.
Please give me your recommendation on the time/temperature/stack control.
Thanks in advance
__ __
__ Irving Lee - PacRim PWB Qualification Office - TAO/1BBF __
__ E-mail: TAENG::IRVINGLEE ([log in to unmask]) __
__ Phone: +886-3-3900000 Ext:2164 Fax: +886-3-3908533 __
From: TAENG::US3RMC::"[log in to unmask]" "MAIL-11 Daemon" 16-NOV-1995 00:43:01.62
To: [log in to unmask]
CC:
Subj: Delamination
HI
1.-As european PCB fabricator I am looking for IPC spec. about baking ML
boards before IR reflow to prevent delamination.
In my experience this prebaking is necessari because uncontroled humidity
absortion. We feel that whit > 0,1% humidity absorved, there is potential
risk of delamination even in a standard parameters of IR reflowing.
2.- I am looking too for IPC standards in CD-ROM format.
Any information will be apreciated.
Jose Muelas LAB CIRCUITS S.A. (Spain)
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