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Date: | Wed, 27 Sep 1995 11:34:43 -0400 |
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Does anyone have any experience soldering surface mount devices to
Electrolytic Tin plating as opposed to Tin/Lead reflow or HAL? We have a
customer that is interested in this but wants us to ensure that they'll be
able to solder the boards. They are using a BTU convection oven for
reflowing the boards after assembly. Thanks in advance for any
correspondence.
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