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1995

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Tue, 22 Aug 1995 18:07:34 -0400
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Samples to be subjected to thermal stress (10 seconds/550F) are to be baked
for 6 hr minimum at  120 - 149C.  Of course, if the samples are very thick
and are multilayers with ground or power planes a longer bake may be used
prior to the stress.  This infomation is found in IPC-RB-276, para 3.10



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