Subject: | |
From: | |
Date: | Mon, 31 Jul 1995 10:31:49 -0500 |
Content-Type: | text/plain |
Parts/Attachments: |
|
|
Designing thermals on power and ground planes:
I've heard that rule-of-thumb is an ID of 0.015" over the hole size, and an
OD of 0.020" over the ID.
Questions:
1. Does IPC have a spec for thermal relief?
2. Do the rules change as the hole size changes?
Thanks in advance.
-Pat-
-------------
Patrick McGuine
Nicolet Instrument
[log in to unmask]
(608) 276-6334
|
|
|