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Date: | Mon, 01 May 1995 08:49:22 -0500 |
Content-Type: | text/plain |
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Brendan,
I use the following for breakout:
five 0.031" nonplated holes 0.050 center to center, 0.020" in from board edge.
I use a 0.093 route.
---- ----------
\ /
____/| \_________ board edge
| # # # # # 5 holes 0.020 +/-0.005" in from board edge
| |
| |
-----| |---- 0.090"
> From [log in to unmask] Fri Apr 28 13:43:20 1995
> Resent-Date: Fri, 28 Apr 1995 16:37:11 +0100 (WET DST)
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> From: brendan mccormack <[log in to unmask]>
> Subject: Scoremarks and break-out lugs
> To: TechNet <[log in to unmask]>
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> Hi there,
>
> Yes, you guessed it - Friday afternoon is my email time - what better way
> to relax before the hectic weekend ahead !..
>
> I am looking for some info. about board scoring and in particular
> proximity of components to scoremarks. I understand the problems ..
> mechanical stressing of solder joints etc. .. but wanted to find out what
> spacing people are using out there.
>
> I guess that there should be different spacings dependant on :
> - component package (1206, SOT-23, SOIC etc.)
> - Breaking method (by hand, guillotine, breaking fixture etc.)
> - Score depth etc.
>
> I'd also be interested in feedback from those who use break out lugs on
> their panels.
>
> Is anybody willing to share their experiences with the forum?
> I'd appreciate any references to relevant literature also.
>
> Thanks in advance..
>
>
> Brendan McCormack
> Senior Interconnect Engineer
> AMT Ireland
> Electronics Manufacturing Centre
> University of Limerick
> Limerick
> Ireland
>
> Ph. +353 61 331588
> Fx. +353 61 330316
> EM. [log in to unmask]
>
>
>
>
>
>
>
-Pat-
-------------
Patrick McGuine
[log in to unmask]
(608) 276-6334
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