TECHNET Archives

1995

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Condense Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Received:
by ipchq.com (Smail3.1.28.1 #2) id m0sIe6V-0000GeC; Mon, 5 Jun 95 10:30 CDT
Old-Return-Path:
<miso!aol.com!SIRGuru>
Date:
Mon, 5 Jun 1995 11:04:05 -0400
Precedence:
list
Resent-From:
Resent-Sender:
X-Status:
Status:
O
X-Mailing-List:
<[log in to unmask]> archive/latest/571
From [log in to unmask] Fri Apr 26 13:
53:47 1996
TO:
Return-Path:
Resent-Message-ID:
<"vfvqp1.0.kBF.-Boql"@ipc>
Subject:
From:
X-Loop:
Message-Id:
Parts/Attachments:
text/plain (13 lines)
If I may suggest, contact David Hillman, Rockwell International, Cedar
Rapids, Iowa.  Internet address:  [log in to unmask]

Dave has had extensive experience with SERA technology, examining the
solderability of various finishes with time.  Dave also heads us the IPC
committees on J-STD-002 and 003, which deal with the solderability of
components and boards.

Doug Pauls aka [log in to unmask]
Contamination Studies Labs.



ATOM RSS1 RSS2