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Thu, 21 Dec 1995 10:36:14 -0500 |
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| From [log in to unmask] Sat Apr 27 15: |
32:55 1996 |
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I have stenciled adhesives and we used a rectangular appeture approx. .010" x
.055" placed directly in the center of the components, except for SOICs then
we used multiple ones to eliminate the possibility of part shifting.
Hope this helps.
Marty Greene
President -- Circuits, Inc.
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