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by ipchq.com (Smail3.1.28.1 #2)
id m0sIKNT-0000GzC; Sun, 4 Jun 95 13:26 CDT |
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04 Jun 95 13:22:03 EDT |
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| From [log in to unmask] Fri Apr 26 13: |
53:38 1996 |
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Solder beads form at the side of chip parts during reflow soldering. Solder
paste particles under the component join together at reflow temperature and
cause the chip to lift allowing the bead to be released to the side of the
component. In the some cases the part can stay lifted and others the resulting
ball in left by the part.
Would any one like to make comment on any unusual causes for this problem.
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