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by ipc.org (Smail3.1.28.1 #2)
id m0tPcDj-0000MTC; Tue, 12 Dec 95 15:26 CST |
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<miso!pc.Trimble.COM!SBANKS.MFG> |
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Tue, 12 Dec 1995 10:59 PST |
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| From [log in to unmask] Sat Apr 27 15: |
28:32 1996 |
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I have a question about reflow soldering to gold with 2% silver paste.
I heard some folk lore at our company about using 2% silver solder paste
on gold plated lands. The legend states that 62/36/2 paste on gold has
long term reliability implications, these joints being subject to
dendritic growth to a greater degree than 63/37 solder to gold.
If anyone is aware of published data on this subject, I would be very
grateful if you would give me the references so I may review the
information.
Also, if anyone is using silver solder on gold at this time, I would be
interested in hearing about your experience.
Please respond by the technet, to my e-mail address
([log in to unmask]) or my phone (408/481-6047)
Thanks and regards
Sherman Banks
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