 
| Received: |
by ipc.org (Smail3.1.28.1 #2)
id m0tNoI5-0000M1C; Thu, 7 Dec 95 15:55 CST |
| Encoding: |
15 TEXT |
| Old-Return-Path: |
<miso!wilcox.com!davis> |
| Date: |
Thu, 07 Dec 95 15:04:00 CST |
| Precedence: |
list |
| Resent-From: |
|
| Resent-Sender: |
|
| X-Status: |
|
| Status: |
O |
| X-Mailing-List: |
|
| From [log in to unmask] Sat Apr 27 15: |
26:51 1996 |
| TO: |
|
| Return-Path: |
|
| Resent-Message-ID: |
<"kZW153.0.hK7.VBsnm"@ipc> |
| Subject: |
|
| From: |
|
| X-Loop: |
|
| X-Mailer: |
Microsoft Mail V3.0 |
| Message-Id: |
|
| Parts/Attachments: |
|
|
We are looking at eliminatingng the gold plating on some large (18" x 24")
microstrip boards by having the supplier coat the boards with ENTEK. These
microstrips are on Teflon (GXN) substrate.
1) Does anyone have experience using ENTEK on Teflon sunstrate?
2) Can we IR reflow the components to the board while using ENTEK? Do we
need to remove the ENTEK before assembly?
I would appreciate any help.
Phil Davis
Manager Mechanical Engineering & Packaging
Wilcox Electric, Inc
|
|
|
