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| From [log in to unmask] Sat Apr 27 15: |
25:41 1996 |
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In addition to better throughput, foil construction
eliminates the need for covering what will become the outer
layer surface with a film etch resist. Resist would be
required on an all-core construction on the outer layers to
keep the copper from being etched away. In this same vein,
handling scratches on this protective etch resist would
cause lower yields. This is all avoided by adding foil to
top and bottom after the inner layer etch process, but
before pressing.
Tom Coyle
Field Services Engineer
HADCO Corporation
[log in to unmask]
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