 
| Received: |
by ipc.org (Smail3.1.28.1 #2)
id m0tLzTK-0000LuC; Sat, 2 Dec 95 15:27 CST |
| Old-Return-Path: |
<miso!aol.com!DDFRITZ> |
| Date: |
Sat, 2 Dec 1995 16:25:21 -0500 |
| Precedence: |
list |
| X-Loop: |
|
| Message-ID: |
|
| X-Status: |
|
| Status: |
O |
| X-Mailing-List: |
|
| From [log in to unmask] Sat Apr 27 15: |
24:09 1996 |
| TO: |
|
| Return-Path: |
|
| Resent-Message-ID: |
<"YVHHV1.0.ofB.LJCmm"@ipc> |
| Subject: |
|
| From: |
|
| Resent-Sender: |
|
| Resent-From: |
|
| Parts/Attachments: |
|
|
We receive questions about plating high Z axis expansion board materials.
When the expansion from assembly soldering is too great, surface pads around
the holes lift, or the plated barrel cracks. Does anyone have a standard
practice to prevent these phenomena when using laminate with great amounts of
Z axis expansion (we think more than 6%)?
Thicker plating in the hole?
Alternate metals plated?
Dennis Fritz
MacDermid, Inc.
245 Freight Street
Waterbury CT 06702
Phone 203-575-5740
|
|
|
