TECHNET Archives

1995

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Condense Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Received:
by ipc.org (Smail3.1.28.1 #2) id m0tLB1P-0000MAC; Thu, 30 Nov 95 09:35 CST
Content-Type:
TEXT/PLAIN; charset=US-ASCII
Old-Return-Path:
<dammth>
Date:
Thu, 30 Nov 1995 09:35:22 -0600 (CST)
Precedence:
list
Resent-From:
cc:
MIME-Version:
1.0
Status:
O
X-Mailing-List:
<[log in to unmask]> archive/latest/286
From [log in to unmask] Sat Apr 27 15:
22:36 1996
TO:
APeder01 <[log in to unmask]>
Return-Path:
X-Status:
Resent-Message-ID:
<"CxXPR3.0.ajA.3zSlm"@ipc>
Subject:
From:
Thomas Dammrich <[log in to unmask]>
Resent-Sender:
In-Reply-To:
X-Loop:
Message-ID:
<Pine.3.89.9511300903.C33091-0100000@ipc>
Parts/Attachments:
TEXT/PLAIN (25 lines)
You may also want to take a look at the IPC-MC-790, Guidelines for 
Multichip Module Technology Utilization.

This document provides information on Multichip Module Technology 
including parametric data, design and manufacturing information.  
Additional descriptive information regarding many of the issues and 
trade-offs surrounding this technology may be obtained from the 
references in the Bibliography.

This publication is available from IPC for $35 for IPC members and $70 
for nonmembers.  IPC members can order by email to [log in to unmask] or by 
calling 708-509-9700.

On 29 Nov 1995, APeder01 wrote:

> 
>           Is there any IPC documentation for design and/or
>           acceptability of MCM-Ls?  If not, is there some in process,
>           or do we use IPC-D-275 and IPC-RB-276 the best we can?
> 
> 
> 



ATOM RSS1 RSS2