TECHNET Archives

1995

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Condense Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Received:
by ipc.org (Smail3.1.28.1 #2) id m0tJoH6-0000V4C; Sun, 26 Nov 95 15:06 CST
Old-Return-Path:
<miso!aol.com!GaryF40>
Date:
Wed, 22 Nov 1995 16:29:04 -0500
Precedence:
list
X-Loop:
Message-ID:
X-Status:
Status:
O
X-Mailing-List:
<[log in to unmask]> archive/latest/245
From [log in to unmask] Sat Apr 27 15:
20:40 1996
TO:
Return-Path:
Resent-Message-ID:
<"0rkPt.0.qgB.0RDkm"@ipc>
Subject:
From:
Resent-Sender:
Resent-From:
Parts/Attachments:
text/plain (13 lines)
Mark,

You are correct. The IPC Design committee recommends sending 1:1 design data.
The fabricator will adjust, for etch factors, at his specific facility. The
ssame should hold true for soldermask and solder paste stencil data.

Regards,

Gary Ferrari
Tech Circuits



ATOM RSS1 RSS2