Received: |
by ipc.org (Smail3.1.28.1 #2)
id m0tHfyS-0000GnC; Mon, 20 Nov 95 17:50 CST |
Content-Type: |
text/plain; charset=US-ASCII |
Old-Return-Path: |
<miso!halsp.hitachi.com!gulleyj> |
Date: |
Mon, 20 Nov 1995 10:11:00 -0800 |
Precedence: |
list |
Resent-From: |
|
Resent-Sender: |
|
Content-Transfer-Encoding: |
7bit |
Status: |
O |
X-Mailing-List: |
|
From [log in to unmask] Sat Apr 27 15: |
19:00 1996 |
TO: |
|
Return-Path: |
|
X-Status: |
|
Content-Description: |
cc:Mail note part |
Subject: |
|
From: |
|
X-Loop: |
|
Mime-Version: |
1.0 |
Resent-Message-ID: |
<"Fbm4R.0.dF6.lGHim"@ipc> |
Message-Id: |
|
Parts/Attachments: |
|
|
Address,
Can anyone supply technical laymen information on Speed Ball and
Polyimide Laminates. I would also appreciate any test data (e.g.
thermal, humidity, solder, tensile strength tests) that have been
performed to prove the long reliability of these materials. A
material characteristics sheet is also helpful. Thank you.
John Gulley - PCB Project Coordinator
Hitachi Computer Products Division
1800 East Imhoff Rd
Norman, OK 73071
[log in to unmask]
405-360-5500 x634
|
|
|