Mime-Version: |
1.0 |
Content-Type: |
text/plain; charset="us-ascii" |
Old-Return-Path: |
<miso!xeta.com!tomc> |
Date: |
Wed, 25 Oct 1995 08:55:31 -0500 |
Precedence: |
list |
Resent-From: |
|
Resent-Sender: |
|
X-Status: |
|
Status: |
O |
X-Mailing-List: |
|
From [log in to unmask] Sat Apr 27 15: |
12:40 1996 |
X-Sender: |
|
TO: |
|
Return-Path: |
|
Resent-Message-ID: |
<"VM_fD3.0.MJA.fyiZm"@ipc> |
Subject: |
|
From: |
|
X-Loop: |
|
Received: |
by ipc.org (Smail3.1.28.1 #2)
id m0t8FiP-0000HxC; Wed, 25 Oct 95 18:58 CDT |
X-Mailer: |
Windows Eudora Version 1.4.4 |
Message-Id: |
|
Parts/Attachments: |
|
|
Richard,
I'd like more info on how passive components are more subject to damage by
wave soldering that active ones. We are working on a new PCB design and
recently eliminated all active components from the back of it. It now has
only caps. How much of a production problem might this represent? What
failure rates have you seen on passives?
>I have been running the wave soldering courses for Electrovert for 8 years, I
>have worked in sub contract manufcatre for two years and before that 15
years in
>a major OEM. Wave soldering of SOIC devices is not a problem. There has
been far
>more problems with SOT23 and pasive components.
>
>Soldering QFP devices may need some baking prior to wave soldering.
Provided you
>evaluate the comoponents prior to use, test there process compatability it is
>not a problem.
>
>There are hundreds of users wave soldering SOIC devices, not always well but
>that is another issue. During workshops on soldering I conducted 5 years ago in
>your country many of the assembly plants were running SOIC devices through the
>wave,
>
>Bob Willis
>Tel 01245 351502
>Fax 01245 496123
>
>
>
+------------------------------------------
|
| Tom Crofford
| [log in to unmask]
|
| 918-664-6876 fax
|
+------------------------------------------
|
|
|