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FROM: BRUCE HOUGHTON 27/552/844/TOR
*** Resending note of 05/11/95 11:12
Phone (416) 448-5701 Tie 778-5701
Subject: Tin/lead plating vs HAL
Doug,
Tin/lead plated (and reflowed) tabs over nickel will give a very
consistent and controlled thickness of solder over the tabs.
HASL is difficult to control for both thickness and uniformity.
Tin/lead plate and reflow tabs may cost a little more.
Bruce Houghton
Celestica, Inc
=========================================================================
> Date: Thu, 11 May 1995 06:47:38 EDT
> From: [log in to unmask] (MR DOUGLAS C JEFFERY)
-- [ From: Douglas C. Jeffery * EMC.Ver #2.10P ] --
I recently had a customer inquire about the advantages or disadvantages
of using tin/lead plating over HAL for a connector application (SIMMs).
We have been 100% HAL for several years and I couldn't really answer
his question other than to say we don't have a tin/lead bath...So..Are
there any thoughts as to one method being preferred over the other?
(note. the question is about the insertion tabs not component
attachment, and he currently is not using ni/au).
Thanks for any insight.
Doug Jeffery
Electrotek, Inc.
[log in to unmask]
414-762-1390
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