 
| Received: |
by ipchq.com (Smail3.1.28.1 #2)
id m0ssBgf-0000GlC; Mon, 11 Sep 95 11:26 CDT |
| Old-Return-Path: |
<miso!mail.mei.com!BOB.HOENE> |
| Date: |
Mon, 11 Sep 1995 11:01:25 -0600 |
| MIME-version: |
1.0 |
| Precedence: |
list |
| From [log in to unmask] Sat Apr 27 14: |
45:29 1996 |
| Resent-Sender: |
|
| X-Status: |
|
| Status: |
O |
| X-Mailing-List: |
|
| TO: |
|
| Return-Path: |
|
| X-Loop: |
|
| Message-id: |
|
| Content-type: |
TEXT/PLAIN; CHARSET=US-ASCII |
| Subject: |
|
| From: |
|
| Resent-From: |
|
| Resent-Message-ID: |
<"nlRar1.0.MvA.lC6Lm"@ipc> |
| X-Mailer: |
Novell GroupWise 4.1 |
| Content-transfer-encoding: |
7BIT |
| Parts/Attachments: |
|
|
WOULD ANYONE CARE TO ADVISE THE GUIDELINES FOR FLEXIBLE
PRINTED WIRING PERTAINING TO PRE-BAKE BEFORE ASSEMBLY.
DURING THIS LAST AND LONG HOT SUMMER, WE SEEM TO HAVE
EXPERIENCED UNFAVORABLE STORAGE CONDITIONS AND OUR FLEX
CIRCUITS ARE "BLISTERING", THAT IS, THE COVERLAY IS LETTING GO
OF THE BASE MATERIAL DURING PROCESSING. WE BELIEVE THIS TO
BE A MOISTURE RELATED PROBLEM. WE WAVE SOLDER AND IR
REFLOW CIRCUITS IN OUR PROCESS. YOUR ADVICE AS TO BAKE
TEMPERATURE, DURATION, AND SUGGESTED WORKING TIME
ALLOWABLE BETWEEN BAKE AND ASSEMBLY WOULD BE
APPRECIATED.
|
|
|
