Having a problem with solder being randomly trapped 
under SOIC's (gull wing) and SOJ's ("J" leaded devices) on 
the solder side of the board after wave solder. The solder 
"disks" or "specks" range from .005 to .030". These can only 
be detected by x-ray since they show up under the body of 
the component. 

     Has anyone seen this problem before or have it now.What 
has been done to prevent this from happening, short of not 
putting these devices on the solder side of the board. 
(This is not an option as of now)

     Does anyone feel this is a liability if left on the 
board if board passes test, and solder is trapped. (I will 
be doing shock & vib. testing to ensure they do not move)

     Any input would be appreciated.

                                   Thanks,
                                        Al Boulais           
                          
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(603) 337-1253