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Sat, 2 Sep 1995 22:04:30 -0400 |
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| From [log in to unmask] Sat Apr 27 14: |
42:27 1996 |
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I manage a captive PWB shop that produces 4,000 square feet per week of
double sided plated thru hole product from .062 FR-4 copper laminate. Our
product is a bit uncommon in that it has about .0004 inch hard nickel plated
over the copper traces. Thru testing, we find a VERY thin layer (maybe 150
angstroms) of some contaminate that affects the surface conductivity when it
is used as a switch half with a stainless steel snap dome. Using a
Scotchbrite pad to burnish the surface provides a solution, but I would like
to know the source of the substance and how to prevent it in the original
process. Any ideas on the subject?
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