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We are studying use of Ni-Au plated circuit boards. One concern which
arose is that some of the gold will be dissolved as the board crosses
the solder wave and gradually contaminate the pot. Is this a valid
concern?
We have never had a copper contamination problem even though we solder
many copper boards. We use a dual wave solder and RMA flux.
Thanks,
Allen Ahlert
[log in to unmask]
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