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| From [log in to unmask] Sat Apr 27 14: |
41:18 1996 |
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FROM: BRUCE HOUGHTON 27/552/844/TOR
Phone (416) 448-5701 Tie 778-5701
Subject: solubility of gold into solder pot from Ni-Au board
Allen,
The impact of the gold on the solder pot depends on the % of boards
that will be nickel/gold, the thickness of the gold (good luck if
you are using 'plated' gold, instead of immersion gold), how often
and how well you maintain the solder pot. You will have to increase
the frequency of the analysis of the solder pot for gold, until
you are know what it is performing.
Bruce Houghton
Staff Engineer, Celestica, Inc.
Internet: [log in to unmask]
*** Forwarding note from SMTP2 --IINUS1 08/29/95 14:30 ***
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