Received: |
by ipchq.com (Smail3.1.28.1 #2)
id m0skxHy-0000GlC; Tue, 22 Aug 95 12:39 CDT |
Old-Return-Path: |
<miso!aol.com!EnviEng> |
Date: |
Tue, 22 Aug 1995 13:33:55 -0400 |
Precedence: |
list |
X-Loop: |
|
Message-ID: |
|
X-Status: |
|
Status: |
O |
X-Mailing-List: |
|
TO: |
|
Return-Path: |
|
Resent-Message-ID: |
<"vZ6Dn1.0.GSI.rOXEm"@ipc> |
Subject: |
|
From: |
|
Resent-From: |
|
Resent-Sender: |
|
From [log in to unmask] Sat Apr 27 14: |
37:09 1996 |
Parts/Attachments: |
|
|
Hello all:
We would like some information on temperature and time required prior to
testing a sample in the solder pot for solder float/shock testing.
We checked in the IPC Test Methods but could not find the specific
information that we were looking for. Any help would be greatly appreciated!
Sincerely,
Lou Cerone, Process Engineer
Benny George, Quality Control Tech
|
|
|