 
| Received: |
by ipchq.com (Smail3.1.28.1 #2)
id m0sii4v-0000HhC; Wed, 16 Aug 95 08:00 CDT |
| Old-Return-Path: |
<miso!eda.mke.ab.com!zorn> |
| Date: |
Wed, 16 Aug 95 07:00:11 CDT |
| Precedence: |
list |
| Resent-From: |
|
| Cc: |
|
| X-Status: |
|
| Status: |
O |
| X-Mailing-List: |
|
| TO: |
|
| Return-Path: |
|
| Resent-Message-ID: |
<"lO92R.0.VLH.TlUCm"@ipc> |
| Subject: |
|
| From: |
|
| Resent-Sender: |
|
| X-Loop: |
|
| From [log in to unmask] Sat Apr 27 14: |
34:10 1996 |
| Message-Id: |
|
| Parts/Attachments: |
|
|
> Robert Blomstrom wrote:
> This allows you to add resistors without
> putting them on the surface and without
> adding substantial thickness since the layer
> is 0.1-0.4 microns thick for the resistive material.
>
> My facility designs and fabricates using this
> technique for designs where the density is too
> great to use surface components.
What is the cost attributed to this type of process for a typical 4-layer FR-4 PCB?
\_\_\_\_\_\_\_\_\_\_\_\_\_\_\_\_\_\_\_\_\_\_\_\_\_\_\_\_\_\_\_\_\_\_\_\_\_\_
\_ \_
\_ Todd J. Zorn Email: [log in to unmask] \_
\_ Technical Analyst - PCB Design \_
\_ The Allen-Bradley Company \_
\_ 1201 South Second Street \_
\_ Dept. J8751, Control Logic Phone: (414) 382-3971 \_
\_ Milwaukee, Wi. USA 53204 FAX: (414) 382-3737 \_
\_ \_
\_\_\_\_\_\_\_\_\_\_\_\_\_\_\_\_\_\_\_\_\_\_\_\_\_\_\_\_\_\_\_\_\_\_\_\_\_\_
|
|
|
