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| From [log in to unmask] Sat Apr 27 14: |
33:50 1996 |
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We have been wave soldering SOIC and SOJ packages for quite some
time, but recently we are finding solder balls flattened like pancakes
underneath these devices after wave solder. The package stand-offs are
the standard 8-10 mils for the SOICs and 25-26 mils for the SOJs and
we have not been able to identify any process or material changes that
may be causing this phenomenon.
Has anyone had a similar experience and found the cause for this
defect? Any help would be much appreciated.
Ray Turner
Cabletron Systems
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