Received: |
by ipchq.com (Smail3.1.28.1 #2)
id m0sekgj-0000GvC; Sat, 5 Aug 95 09:58 CDT |
Old-Return-Path: |
<miso!aol.com!SIRGuru> |
Date: |
Sat, 5 Aug 1995 08:04:06 -0400 |
Precedence: |
list |
Resent-From: |
|
Cc: |
|
X-Status: |
|
Status: |
O |
X-Mailing-List: |
|
TO: |
|
Return-Path: |
|
Resent-Message-ID: |
<"Yc-Wm1.0.HFD.kSu8m"@ipc> |
Subject: |
|
From: |
|
Resent-Sender: |
|
X-Loop: |
|
From [log in to unmask] Sat Apr 27 14: |
28:59 1996 |
Message-Id: |
|
Parts/Attachments: |
|
|
Sir,
Many times the loss of soldermask adhesion can be traced to inadequate
cleaning of the base material, leaving a residue which interferes with the
solder mask adhesion. What kinds of pre-masking cleaning are you doing?
What is your cure cycle?
Doug Pauls
[log in to unmask]
|
|
|