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Fri, 4 Aug 1995 12:30:46 +0200 |
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| From [log in to unmask] Sat Apr 27 14: |
28:39 1996 |
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Does anyone have any information or case study references regarding the
chemical resistance of soldermask? Presently we use Peters LPI soldermask
type GL 2469. After electroless nickel and immersion gold process (Aureus,
Shipley) we have noticed peeling effects at soldermask edges. Comments and
suggestions how to avoid these effects are appreciated, either via the IPC
TechNet Forum or directly to my e-mail box.
Thanks
Kazimierz FRIEDEL
Eldos, Wroclaw, Poland
e-mail: [log in to unmask]
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