TECHNET Archives

1995

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Condense Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Received:
by ipchq.com (Smail3.1.28.1 #2) id m0saW99-0000GoC; Mon, 24 Jul 95 17:38 CDT
Old-Return-Path:
<miso!likom.com.my!lbrs>
Date:
Sat, 22 Jul 95 11:28:29 EST
Precedence:
list
X-Loop:
Resent-Sender:
X-Status:
Status:
O
X-Mailing-List:
<[log in to unmask]> archive/latest/718
TO:
Return-Path:
Resent-Message-ID:
<"IjakD1.0.bh6.q325m"@ipc>
Subject:
From:
Resent-From:
From [log in to unmask] Sat Apr 27 14:
24:55 1996
Message-Id:
Parts/Attachments:
text/plain (31 lines)
     
     Hello,
     Our company largest DS PCB manufacturer in Malaysia.We are 
     encountering
     the soldermask skip problem.I give below the parameters used.
     
     M/C Burkle Curtain coater
     Ink Peters GL2469sm
     
     Viscosity 60to65
     Beltspeed 78m/mim
     web weight 6.4to 6.8gms/600sqcm
     
     We use pattern plating process and plating thickness 40to 60 microns.
     
     The Sm skip is random and happens near closely spaced tracks(most of 
     the times).
     
     I Shall be highly grateful if anyone can give info to minimise the
     sm skip problem.
     
     Thanks
     R.Srinivasan
     
     Likom PCB SDN BHD
     Malacca Malaysia
     
     E-mail :[log in to unmask]



ATOM RSS1 RSS2