 
| Received: |
by ipchq.com (Smail3.1.28.1 #2)
id m0sTUwo-0000GoC; Wed, 5 Jul 95 08:57 CDT |
| Old-Return-Path: |
<miso!enscan1.itron.com!mitcha> |
| Date: |
Wed, 5 Jul 95 08:56:18 CDT |
| Precedence: |
list |
| X-Loop: |
|
| Resent-Sender: |
|
| X-Status: |
|
| Status: |
O |
| X-Mailing-List: |
|
| TO: |
|
| Return-Path: |
|
| Resent-Message-ID: |
<"17_VE.0.xFA.ief-l"@ipc> |
| Subject: |
|
| From: |
|
| Resent-From: |
|
| From [log in to unmask] Sat Apr 27 14: |
20:57 1996 |
| Message-Id: |
|
| Parts/Attachments: |
|
|
Hello,
Our design requirements are driving us to finer pitch technologies. We
currently assemble 50mil pitch devices. My expectation is that our next
generation of products will be 20 to 25 mil pitch. I am interested in hearing
war stories of people who have been through this process. Specifically, what
was the number one problem encountered and how was it overcome?
Thanks
Mitch Austin
Itron
[log in to unmask]
|
|
|
