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TechNet E-Mail Forum <[log in to unmask]>
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Thu, 3 Mar 2022 12:41:06 +0000
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TechNet E-Mail Forum <[log in to unmask]>, "Tempea, Ioan" <[log in to unmask]>
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"Tempea, Ioan" <[log in to unmask]>
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Thanks Joyce,

Wire bonding it is, indeed. Sorry Bev, I should have mentioned this!

And wire bonding is with Au wire, on Au and Al pads.

Any N vs air theory or studies?

Cheers,

Ioan

-----Message d'origine-----
De : Yuan-chia Joyce Koo <[log in to unmask]> 
Envoyé : mars 02, 2022 16:37
À : TechNet E-Mail Forum <[log in to unmask]>; Tempea, Ioan <[log in to unmask]>
Objet : Re: [TN] Dry air vs. Nitrogen purge

if it is for wire bonding, dry air is not good enough.  (unless you use it within 2-3 wks... you will see yield goes down... IMHO).
On Mar 2, 2022, at 7:52 AM, Tempea, Ioan wrote:

> Dear Technet,
>
> Obviously Nitrogen purged cabinets are the best thing to have for 
> storage of bare die and even packaged components.
>
> But do you have any experience showing that dry air purged cabinets, 
> properly controlled, are not up to the task?
>
> Thanks,
>
> Ioan Tempea
>
>
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