Just read this about the chip shortage...this is really bad.
https://www.electronicsweekly.com/news/business/worst-chip-shortage-ever-2021-08/
Steve
On Tue, Aug 31, 2021 at 8:43 AM [log in to unmask] <
[log in to unmask]> wrote:
> Its possible these parts are molded this way by design. Have you checked
> the component print and verified whether or not they meet the print spec
> for body thickness?
> If they don't, its back to the vendor with them in their original
> packaging!
>
> -----Original Message-----
> From: TechNet <[log in to unmask]> On Behalf Of Steve Gregory
> Sent: Tuesday, August 31, 2021 9:00 AM
> To: [log in to unmask]
> Subject: Re: [TN] QFP Popcorn...
>
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> Yeah, the parts were in a sealed MBB and the label has these at MSL3 and
> the HIC card was solid blue. Only discovered this after starting to build
> and noticed that the QFP's were raised. Pulled one up and noticed the
> blister on the bottom. Reflow profile was a typical SAC305 profile. Looked
> in the trays and saw that a good number of them were already popcorned just
> sitting in the tray. The blister is always on the bottom, is that where the
> plastic is usually the thinnest, and why that it's on the bottom?
>
> This is just an off the wall question, and I think I know the answer, can
> these parts popcorn like this and still function? I know the packaging has
> been compromised, but if the wire bonds weren't broken when it popcorned,
> that would explain why the board would still function. Another off the
> wall question, what if we went through these parts and tried to visually
> sort the good ones from the bad ones, then baked the ones that looked good
> and used them? I think all of them should be scrapped. But people are
> getting pretty desperate in these times with the component shortages out
> there.
>
> Steve
>
> Steve
>
> On Tue, Aug 31, 2021 at 6:56 AM <[log in to unmask]> wrote:
>
> > Steve,
> > Nope. Closest is parts were taken from a nitrogen cabinet, placed and
> > soldered and then found to be like that. No one ever hooked nitrogen
> > up to the new cabinet!
> >
> > Regards,
> > Bev
> >
> > -----Original Message-----
> > From: TechNet <[log in to unmask]> On Behalf Of Steve Gregory
> > Sent: August 31, 2021 8:28 AM
> > To: [log in to unmask]
> > Subject: [TN] QFP Popcorn...
> >
> > Morning all,
> > Have any of you ever received QFP's that looked like this right out of
> > the tray? It wasn't in factory packaging, and we didn't bake them...
> >
> > https://photos.app.goo.gl/ZreHZdYaFLB9TLRi6
> >
> > Steve
> >
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> --
> Steve Gregory
> Kimco Design and Manufacturing
> Process Engineer
> (208) 322-0500 Ext. -3133
> Cell Phone: (918) 706-2779
>
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Steve Gregory
Kimco Design and Manufacturing
Process Engineer
(208) 322-0500 Ext. -3133
Cell Phone: (918) 706-2779
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