What you are looking for is IPC-HDBK-850. This standard covers component staking (staking is adhesive bonding the sides of a component to the substrate), underbonding and underfilling, die potting, dam and fill, connector potting, backfilling, curing, hardness testing to ensure a full cure took place, all about different encapsulants and materials, mixing, curing, dispensing, you name it, its in there. I put a lot of work into this standard back in 2011-2012, as did many others. I may be personally biased, but I think it is an excellent source of information and guidelines for everything related to adhesives and their proper use in electronic assemblies. I remember people such as Jade Bridges, Barry Ritchie, and your buddies Nate Grindvalds and Doug Pauls also contributed to this standard, so they should have a copy handy. I certainly received more from the finished efforts of the team than I personally invested into it and I highly recommend it to anyone who has questions about bonding, staking, potting and encapsulation. It is a great guide.
Odin Stadem

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From: TechNet <[log in to unmask]> On Behalf Of Hofer, Ernest E Collins
Sent: Friday, May 21, 2021 2:50 PM
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Subject: [TN] Adhesive Industry Standard

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Wondering if anyone knows of an industry standard which outlines acceptance criteria for the quantity/coverage and/or volume of adhesives to be used generically.  Is this product/design specific thus no industry standard exists?  Please let me know your thoughts!

Thanks!
Eddie Hofer | Pr. Materials & Process AE | Component Engineering - EMMP COLLINS AEROSPACE Cedar Rapids, IA 52498 USA
Tel: +1 319 295 6350
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