While the 850 is a good manual, it is more slanted towards potting.  I
would suggest that the most modern document, though not released yet, is
the Polymeric Standard, being worked on by Bob Cooke in the 5-24g task
group.  It will be published as IPC-5262.  Though somewhat "NASA-ish" in
flavor, it is pretty good.
---
*Douglas Pauls *| Technical Fellow | Electronics AMT

*COLLINS AEROSPACE*

400 Collins Road NE, MS 108-101, Cedar Rapids, IA  52498  USA

*Tel:* +1 319 295 2109 | *Mobile: *+1 319 431 3773

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On Mon, May 24, 2021 at 8:22 AM [log in to unmask] <
[log in to unmask]> wrote:

> What you are looking for is IPC-HDBK-850. This standard covers component
> staking (staking is adhesive bonding the sides of a component to the
> substrate), underbonding and underfilling, die potting, dam and fill,
> connector potting, backfilling, curing, hardness testing to ensure a full
> cure took place, all about different encapsulants and materials, mixing,
> curing, dispensing, you name it, its in there. I put a lot of work into
> this standard back in 2011-2012, as did many others. I may be personally
> biased, but I think it is an excellent source of information and guidelines
> for everything related to adhesives and their proper use in electronic
> assemblies. I remember people such as Jade Bridges, Barry Ritchie, and your
> buddies Nate Grindvalds and Doug Pauls also contributed to this standard,
> so they should have a copy handy. I certainly received more from the
> finished efforts of the team than I personally invested into it and I
> highly recommend it to anyone who has questions about bonding, staking,
> potting and encapsulation. It is a great guide.
> Odin Stadem
>
> -----Original Message-----
> From: TechNet <[log in to unmask]> On Behalf Of Hofer, Ernest E Collins
> Sent: Friday, May 21, 2021 2:50 PM
> To: [log in to unmask]
> Subject: [TN] Adhesive Industry Standard
>
> ----
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> Wondering if anyone knows of an industry standard which outlines
> acceptance criteria for the quantity/coverage and/or volume of adhesives to
> be used generically.  Is this product/design specific thus no industry
> standard exists?  Please let me know your thoughts!
>
> Thanks!
> Eddie Hofer | Pr. Materials & Process AE | Component Engineering - EMMP
> COLLINS AEROSPACE Cedar Rapids, IA 52498 USA
> Tel: +1 319 295 6350
> [log in to unmask]<mailto:[log in to unmask]> |
> collinsaerospace.com<http://collinsaerospace.com/>
>