Good info, Doug. I'm looking forward to seeing that!
Odin

From: Douglas Pauls <[log in to unmask]>
Sent: Monday, May 24, 2021 8:30 PM
To: TechNet E-Mail Forum <[log in to unmask]>; Stadem, Richard D <[log in to unmask]>
Subject: Re: [External] Re: [TN] Adhesive Industry Standard

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While the 850 is a good manual, it is more slanted towards potting.  I would suggest that the most modern document, though not released yet, is the Polymeric Standard, being worked on by Bob Cooke in the 5-24g task group.  It will be published as IPC-5262.  Though somewhat "NASA-ish" in flavor, it is pretty good.
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Douglas Pauls | Technical Fellow | Electronics AMT
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On Mon, May 24, 2021 at 8:22 AM [log in to unmask]<mailto:[log in to unmask]> <[log in to unmask]<mailto:[log in to unmask]>> wrote:
What you are looking for is IPC-HDBK-850. This standard covers component staking (staking is adhesive bonding the sides of a component to the substrate), underbonding and underfilling, die potting, dam and fill, connector potting, backfilling, curing, hardness testing to ensure a full cure took place, all about different encapsulants and materials, mixing, curing, dispensing, you name it, its in there. I put a lot of work into this standard back in 2011-2012, as did many others. I may be personally biased, but I think it is an excellent source of information and guidelines for everything related to adhesives and their proper use in electronic assemblies. I remember people such as Jade Bridges, Barry Ritchie, and your buddies Nate Grindvalds and Doug Pauls also contributed to this standard, so they should have a copy handy. I certainly received more from the finished efforts of the team than I personally invested into it and I highly recommend it to anyone who has questions about bonding, staking, potting and encapsulation. It is a great guide.
Odin Stadem

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From: TechNet <[log in to unmask]<mailto:[log in to unmask]>> On Behalf Of Hofer, Ernest E Collins
Sent: Friday, May 21, 2021 2:50 PM
To: [log in to unmask]<mailto:[log in to unmask]>
Subject: [TN] Adhesive Industry Standard

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Wondering if anyone knows of an industry standard which outlines acceptance criteria for the quantity/coverage and/or volume of adhesives to be used generically.  Is this product/design specific thus no industry standard exists?  Please let me know your thoughts!

Thanks!
Eddie Hofer | Pr. Materials & Process AE | Component Engineering - EMMP COLLINS AEROSPACE Cedar Rapids, IA 52498 USA
Tel: +1 319 295 6350
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