While the 850 is a good manual, it is more slanted towards potting. I
would suggest that the most modern document, though not released yet, is
the Polymeric Standard, being worked on by Bob Cooke in the 5-24g task
group. It will be published as IPC-5262. Though somewhat "NASA-ish" in
flavor, it is pretty good.
---
*Douglas Pauls *| Technical Fellow | Electronics AMT
*COLLINS AEROSPACE*
400 Collins Road NE, MS 108-101, Cedar Rapids, IA 52498 USA
*Tel:* +1 319 295 2109 | *Mobile: *+1 319 431 3773
[log in to unmask]
[log in to unmask] for all Export Compliant Items
On Mon, May 24, 2021 at 8:22 AM [log in to unmask] <
[log in to unmask]> wrote:
> What you are looking for is IPC-HDBK-850. This standard covers component
> staking (staking is adhesive bonding the sides of a component to the
> substrate), underbonding and underfilling, die potting, dam and fill,
> connector potting, backfilling, curing, hardness testing to ensure a full
> cure took place, all about different encapsulants and materials, mixing,
> curing, dispensing, you name it, its in there. I put a lot of work into
> this standard back in 2011-2012, as did many others. I may be personally
> biased, but I think it is an excellent source of information and guidelines
> for everything related to adhesives and their proper use in electronic
> assemblies. I remember people such as Jade Bridges, Barry Ritchie, and your
> buddies Nate Grindvalds and Doug Pauls also contributed to this standard,
> so they should have a copy handy. I certainly received more from the
> finished efforts of the team than I personally invested into it and I
> highly recommend it to anyone who has questions about bonding, staking,
> potting and encapsulation. It is a great guide.
> Odin Stadem
>
> -----Original Message-----
> From: TechNet <[log in to unmask]> On Behalf Of Hofer, Ernest E Collins
> Sent: Friday, May 21, 2021 2:50 PM
> To: [log in to unmask]
> Subject: [TN] Adhesive Industry Standard
>
> ----
> External E-mail --- CAUTION: This email originated from outside GDMS. Do
> not click links or open attachments unless you recognize the sender and
> know the content is safe.
>
> Wondering if anyone knows of an industry standard which outlines
> acceptance criteria for the quantity/coverage and/or volume of adhesives to
> be used generically. Is this product/design specific thus no industry
> standard exists? Please let me know your thoughts!
>
> Thanks!
> Eddie Hofer | Pr. Materials & Process AE | Component Engineering - EMMP
> COLLINS AEROSPACE Cedar Rapids, IA 52498 USA
> Tel: +1 319 295 6350
> [log in to unmask]<mailto:[log in to unmask]> |
> collinsaerospace.com<http://collinsaerospace.com/>
>
|