might just be us and our design and usage case but we don't see much moisture/storage related delam. We tend to use just in time. Also we have a very tight requirement for supplier preship back and moisture barrier packaging and then treat pwbs as moisture sensitive components in inventory.

Missed or skimped bakes in pwb fabs, yeah, that can be an issue.  As can issues with oxide, prepreg age, press profiles, oxide process on plated layers not being up to the requirement for that shiny copper. Also can be design issues that drive delam sensitivity (stackup, via pitch, low pressure areas in copper fill). And that's just the short list.



-----Original Message-----
From: TechNet <[log in to unmask]> On Behalf Of Yuan-chia Joyce Koo
Sent: Thursday, February 18, 2021 2:42 PM
To: [log in to unmask]
Subject: [EXT] Re: [TN] PCBA Delamination

if you have prior qual sample - you might want to contact vendor to find out any possible deviation in process (assume you have nothing wrong on your side - no change of moisture content, no extension of shelf life, reflow oven calibrated properly, etc. etc.).  With winter or summer time, power outage during the lamination process can cause delam - even just few minutes in the press.  root cause analysis is cooperation between user and vendor QA and FA.  you need both to be honest brokers.  IMHO.  (usually you build up relationship before
trouble start.  if you start point fingers at each other, game over.
you might never find your "root cause").
many provide good answer for moisture content evaluation.  it is a lower hanging fruit you might want to start there.
good luck.
jk
On Feb 18, 2021, at 1:27 PM, Datacom - Juliano Ribeiro wrote:

> Hello to all
>
>
>
> We have problems with delamination in our PCBA and we would like to
> test to discover the root cause.
>
> What are the suggestions about test to discover the root cause? The
> goal is to discover if the root cause is internal or it is supplier.
>
>
>
> I saw in the IPC600 and found IPC-TM-650 2.4.28.1, does anyone know
> this test and if that test finds the root cause?
>
>
>
> In particular we could send the images about problems
>
>
>
> Thank you a lot
>
>
>
> Juliano Bettim Ribeiro
>
> DATACOM
>
> Engenharia de Processos
> Rua América, 1000, Bairro Industrial, Eldorado do Sul, RS - 92990-000
> Telefone: +55 51 39333000 - Ramal 3484
>
> Telefone Celular: +55 51 98446-2135
>
> Fax: +55 51 39333003
> site:    <http://www.datacom.ind.br/> www.datacom.ind.br
> e-mail:   <mailto:[log in to unmask]>
> [log in to unmask]
>
>